2024 4th International Conference on Signal Image Processing and Communication (ICSIPC 2024)
Prof. Minghui Li

Prof. Minghui Li

Prof. Minghui Li 116x160.png

Prof. Minghui Li

University of Glasgow, United Kingdom

Brief Introduction

Minghui Li received the B.Eng. and M.Eng. degrees from Xidian University, Xi’an, China, in 1994 and 1999, respectively, and the Ph.D. degree from Nanyang Technological University, Singapore, in 2004, all in electronic and electrical engineering. From 1994 to 1996, he was a Faculty Member with the School of Electronic Engineering, Xidian University. From 1999 to 2000, he was a Research Engineer with SIEMENS (China) Co., Ltd., Beijing, China. From 2003 to 2008, he was first with the School of Electrical and Electronic Engineering and then with the Intelligent Systems Center, Nanyang Technological University as a Research Fellow. From 2008 to 2013, he was a Lecturer (Assistant Professor) with the Department of Electronic and Electrical Engineering, University of Strathclyde, U.K. He joined the James Watt School of Engineering, University of Glasgow, U.K., in August 2013, as an Associate Professor. His research interests include phased array systems and technology, array design and processing, DOA estimation, beamforming, smart antennas, and evolutionary computation, with applications to modern radar, sonar, medical diagnosis, non-destructive evaluation, and wireless communications.

Dr Li has contributed to 2 US patents, 6 books and book chapters, and more than 100 leading international technical journal and peer reviewed conference papers. He worked closely with industry, and has supervised several industrial PhD students and more than 100 industry sponsored undergraduate final-year projects. He received several recognitions for his research, and won the best paper award in 5th International Conference on UK-China Emerging Technologies in August 2020. He served as an associate editor or guest editor for several prestigious international journals. He has been a member of the technical program committees of numerous conferences, and held key appointments in organizing a range of international conferences, including the industry sponsorship chair for CHINACOM 2010, the advisory committee chair for CCISP 2022, the programme chair for ICISPC 2022, and the academic committee chair for ICICM 2023. He is an IEEE senior member and Fellow of the Higher Education Academy.